Core Technical Advantage (Compared with Traditional Microphone Solutions)

MEMS (Micro-Electro-Mechanical System) microphones have comprehensively outperformed traditional electret microphones (ECM) in terms of miniaturization, anti-interference ability, consistency, and integration. According to the 2025 Q3 acoustic component report of the China Electronic Components Industry Association, automotive-grade MEMS microphones can be reduced in size to 1.0mm×1.5mm×0.5mm, which is 82% smaller than the same-performance ECM (3.5mm×4.0mm×1.2mm). They can be easily embedded in miniature terminals such as smart watches and TWS headphones; their signal-to-noise ratio (SNR) reaches 78dB, which is 20% higher than that of ECM (65dB). They can accurately capture weak voice signals in noisy environments; they have a sensitivity consistency of ±1dB, which is 30% better than ECM's ±3dB, and the yield rate during mass production increases by 30%. Moreover, MEMS microphones adopt a fully solid-state structure, with excellent vibration and drop resistance performance. After a 1.5-meter drop test, their performance does not decline, while the failure rate of ECM reaches 15%, making them more suitable for complex environments such as vehicles and industries.

Key Materials and Preparation Breakthroughs

A domestic semiconductor enterprise announced in Q2 2025 a breakthrough in the MEMS microphone diaphragm material: using a "dual-crystal silicon-oxide composite diaphragm" structure, through a low-temperature deposition process to control the uniformity of the film thickness (error ±5nm), the diaphragm's elastic modulus is increased to 180GPa, which is 38% higher than the traditional single-crystal silicon diaphragm (130GPa), and the harmonic distortion in high sound pressure (120dB SPL) environment is reduced from 10% to 1.2%. The related results were published in "Micro-Nano Electronics Technology". At the same time, a certain chip enterprise in the United States developed a "chip-level packaging (CSP) integrated process", integrating MEMS chips, ASIC signal processing chips, and acoustic hole structures into a single package, reducing the package height from 0.8mm to 0.4mm, and through the design of a metal shielding layer, the electromagnetic interference (EMI) suppression ability is increased by 45%, which can directly adapt to the high-frequency signal environment of 5G terminals. This process has increased the yield rate of high-fidelity MEMS microphones from 75% to 94%, and reduced the unit manufacturing cost by 32%.

Industry Application Scenarios Implementation

In the consumer electronics field, TWS headphones are the core application scenario of MEMS microphones. Each pair of high-end TWS headphones uses 4 MEMS microphones (dual-microphone noise reduction + voice wake-up), and a certain brand launched a new TWS headphone model in the first half of 2025, which is equipped with this type of microphone. The active noise reduction depth has been increased to 45dB, which is 28% higher than the previous generation product (35dB), and the clarity of voice communication in noisy environments has been improved by 60%. In the automotive field, the multi-modal interaction system of the intelligent cabin needs to be equipped with 6-8 MEMS microphones to form an array. A certain car manufacturer's high-end model equipped with this array can achieve 360° voice wake-up, with a wake-up distance of 5 meters, and the anti-engine noise interference ability has been improved by 50%, and the accuracy of voice command recognition has increased from 88% to 97%. In the industrial field, MEMS microphones are used for equipment acoustic diagnosis, by capturing abnormal sound waves from motors and pump bodies, faults can be predicted 48 hours in advance, and a chemical enterprise's application has reduced equipment maintenance costs by 40% and non-planned downtime by 55%.